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Thermal Release Tape for Electronic Component Processing

Short Description:

The thermal release tape is a unique adhesive tape that adheres tightly at room temperature and can easily be peeled off just by heating. There are two types : Single-sided, which has a single layer of heat-peelable adhesive, and double sided, with one side having a heat-peelable adhesive and the other a base surface adhesive. Both types make use of polyester film as a base. The tape contributes significantly to automation/laborsaving of various electronic component manufacturing processes.


Product Detail

Product Tags

Product Features 

*Adheres just like any normal adhesive tape at room temperature; can easily be peeled off when necessary by just heating.

*Various shapes available such as in sheets, rolls and labelers.

*Available to select temperatures for releasing.

*Contributes to automation/laborsaving since the tape can be removed at a uniform temperature.

*Does not damage substrates upon tape removal.

Product Technical Data

Thermal Release Tape technical data

Product Application 

*For electronic component manufacturing processes and other various temporary fixing.

*For processing brittle wafer, especially recommended for semiconductor wafer backing grind processing.

Thermal Release Tape application

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